June 9, 2022
At SUR/FIN 2022, in Rosemont, Ill., DuPont Interconnect Solutions (ICS) introduced its Solderon ST-400, a new high-speed tin plating process that offers an improved current density range with more than a 40 per cent increase in plating speed and stable deposit properties across the wide operating range and low whiskering propensity. The new product also features a novel, non-toxic antioxidant that reduces tin oxidation and sludge creation, reducing downtime and maintenance costs.
When electronic components are connected to printed circuit boards, cables, or fibres, the component interface is most often electroplated tin. The lifecycle performance of the component and electronic assembly depends on the characteristics of the plated tin deposit.
According to David Wayness, finishing marketing leader for Dupont’s Electronics and Industrial business, platers and component manufacturers demand the tin plating process be easy to use and control, demonstrate a wide operating window, and exhibit very high and consistent quality using sustainable process chemistry.
“In extensive testing by leading and demanding customers and OEMs, DuPont’s Solderon ST-400 High Speed Tin has been shown to provide an improved current density range and excellent stability,” said Wayness. “This novel tin plating solution is suitable for high-speed reel-to-reel, strip, and wire plating operations.”